2013-12-13 18:00:00 CET

2013-12-13 18:00:01 CET


REGULATED INFORMATION

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Aspocomp Group - Company Announcement

THE HELSINKI COURT OF APPEAL ORDERED ASPOCOMP TO PAY COMPENSATION TO FORMER EMPLOYEES OF ASPOCOMP S.A.S


Espoo, Finland, 2013-12-13 18:00 CET (GLOBE NEWSWIRE) -- 
Aspocomp Group Plc, Company Announcement, December 13, 2013 at 7:00 p.m.

The Helsinki Court of Appeal did not change the decision rendered by the
Helsinki District Court confirming the previous decision by the Court of Appeal
of Rouen. The Court of Appeal of Rouen, France had ruled Aspocomp Group Plc to
pay to thirteen former employees of its French Subsidiary, Aspocomp S.A.S.,
approximately EUR 461 000 and the legal interest. 

The decision of the Court relates to the claims raised by thirteen former
Aspocomp S.A.S. employees (Aspocomp's Company Announcements 18.2.2008,
3.2.2009, 12.5.2010 and 5.7.2013). 

The ruled compensations do not have an impact on the financial result of the
current fiscal year because Aspocomp has earlier made a related provision of
the sufficient amount. 

Aspocomp does not intend to appeal against the verdict of the Helsinki Court of
Appeal. 

For further information, please contact Sami Holopainen, CEO,
tel. +358 20 775 6860, sami.holopainen(at)aspocomp.com.

ASPOCOMP GROUP PLC


Sami Holopainen
CEO

www.aspocomp.com


Aspocomp - PCB technology company

Aspocomp develops and sells PCB manufacturing services. Our seasoned
professionals help customers to create the most optimal PCB designs, both in
terms of performance and cost. Our trimmed production lines produce the most
challenging designs with the shortest lead-times in the industry. Our volume
supply services offer cost-efficient access to all PCB technologies. 



A printed circuit board (PCB) is the principal interconnection method in
electronic devices. PCBs are used for electrical interconnection and as a
component assembly platform in most electronic applications. Aspocomp's PCBs
are used in many applications, such as telecommunication networks and devices,
automotive electronics, security and medical systems, chipset development and
industrial automation.