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2009-03-26 14:45:00 CET 2009-03-26 14:45:02 CET REGULATED INFORMATION Scanfil - Decisions of general meetingSCANFIL PLC'S ANNUAL GENERAL MEETING, 26 MARCH 2009SCANFIL PLC STOCK EXCHANGE RELEASE 26 MARCH 2009 3.45 P.M. SCANFIL PLC'S ANNUAL GENERAL MEETING, 26 MARCH 2009 Scanfil plc's Annual General Meeting has in it's meeting on 26 March 2009 confirmed the Financial Statements for 2008 and discharged the Board of Directors and the President from liability. According to Board of Directors' proposal The Annual General Meeting decided to distribute a dividend total of EUR 0.12 per share on the market. The record date for the payment of dividend is 31 March 2009 and the date of payment of the dividend is 7 April 2009. The Meeting resolved that the Board of Directors consists of five members. Asa-Matti Lyytinen, Jorma J. Takanen, Reijo Pöllä, Jarkko Takanen and Tuomo Lähdesmäki were re-elected as members of the Board of Directors. In it's meeting, held after the General Meeting, the Board of Directors elected Jorma J. Takanen as the Chairman of the Board of Directors and Asa-Matti Lyytinen as Vice Chairman of the Board of Directors. The Meeting decided according to the Board of Directors' proposal to authorize the Board of Directors to decide on the acquisition of the Company's own shares with distributable assets and transfer of the Company's own shares. SCANFIL PLC Harri Takanen President Additional information President Harri Takanen, tel +358 8 4882 111 Distribution NASDAQ OMX Helsinki Major Media www.scanfil.com Scanfil is a global contract manufacturer and systems supplier for communication and industrial electronics with over 30 years experience in demanding contract manufacturing Scanfil offers contract-manufacturing services as a systems supplier to the telecommunication industry, mainly to wireless communication sector, as well as to the industrial electronics industry. Main telecommunication products are among others integrated enclosure systems for mobile phone and ADSL networks and assembly and testing of modules related to enclosure systems. Examples of industrial electronics products include box-built tested devices, various electronic modules, backplanes and assembled circuit boards as well as cable assemblies. Production plants are situated in China, Hungary, Estonia and Finland. |
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