2016-03-10 08:00:02 CET

2016-03-10 08:00:02 CET


REGULATED INFORMATION

English Finnish
Aspocomp Group - Annual Financial Report

ASPOCOMP'S ANNUAL REPORT AND CORPORATE GOVERNANCE STATEMENT FOR 2015 HAS BEEN PUBLISHED


Espoo, Finland, 2016-03-10 08:00 CET (GLOBE NEWSWIRE) -- 
Aspocomp Group Plc, Annual Financial Report, March 10, 2016 at 9:00 a.m.

Aspocomp's Annual Report 2015 has been published in electronic formats. The
complete report is attached to this release as a pdf file and is also available
on the company’s website at www.aspocomp.com/annual report. Aspocomp’s Annual
Report contains the Financial Statements, the report of the Board of Directors,
Auditor’s Report and the Corporate Governance Statement as well as the
Remuneration Statement for 2015. The report is available both in Finnish and in
English. 

Aspocomp’s Corporate Governance Statement 2015 has been published separately
from the Board of Director’s report and is also available on the company’s
website at www.aspocomp.com/governance. 

For further information, please contact Mikko Montonen, CEO,
tel. +358 20 775 6860, mikko.montonen(at)aspocomp.com.

ASPOCOMP GROUP PLC

Mikko Montonen
CEO


Distribution:
Nasdaq Helsinki
Major media
www.aspocomp.com


Aspocomp – PCB technology company

Aspocomp develops and sells PCB manufacturing services, focusing on the
end-to-end fulfillment of customers’ PCB needs. Our seasoned professionals help
customers to create the most optimal PCB designs, both in terms of performance
and cost. Our trimmed production lines produce the most challenging designs
with the shortest lead-times in the industry. Operating as a service business,
we provide one-stop access to technology solutions and competitive products for
all PCB technologies. 

A printed circuit board (PCB) is the principal interconnection method in
electronic devices. PCBs are used for electrical interconnection and as a
component assembly platform in most electronic applications. Aspocomp’s PCBs
are used in many applications, such as telecommunication networks and devices,
automotive electronics, security and medical systems, chipset development and
industrial automation.