2016-12-21 08:00:02 CET

2016-12-21 08:00:02 CET


REGULATED INFORMATION

Finnish English
Aspocomp Group - Corporate Action

ASPOCOMP GROUP PLC: NEW SHARES REGISTERED IN THE TRADE REGISTER


Espoo, Finland, 2016-12-21 08:00 CET (GLOBE NEWSWIRE) -- 
Aspocomp Group Plc, Company Announcement, December 21, 2016 at 9:00 a.m.

Aspocomp Group Plc's CEO has subscribed a total of 90,000 new Aspocomp shares
under the company's 1/2014 stock option terms on November 28, 2016. 

The new shares have been registered in the Trade Register today, December 21,
2016. After the registration of the new shares, the total number of Aspocomp
Group Plc's shares has increased to 6,496,505. The new shares are expected to
be incorporated into the book-entry system and to be admitted to trading on
Nasdaq Helsinki in the same class with the company's other shares on or about
December 22, 2016. 

The new shares carry the right to dividend and other shareholder rights as of
the registration. 


For further information, please contact Mikko Montonen, CEO,
tel. +358 20 775 6860, mikko.montonen(at)aspocomp.com.

ASPOCOMP GROUP PLC

Mikko Montonen
CEO


Distribution:
Nasdaq Helsinki
Major media
www.aspocomp.com


Aspocomp – PCB technology company

Aspocomp develops and sells PCB manufacturing services, focusing on the
end-to-end fulfillment of customers’ PCB needs. Our seasoned professionals help
customers to create the most optimal PCB designs, both in terms of performance
and cost. Our trimmed production lines produce the most challenging designs
with the shortest lead-times in the industry. Operating as a service business,
we provide one-stop access to technology solutions and competitive products for
all PCB technologies. 

A printed circuit board (PCB) is the principal interconnection method in
electronic devices. PCBs are used for electrical interconnection and as a
component assembly platform in most electronic applications. Aspocomp’s PCBs
are used in many applications, such as telecommunication networks and devices,
automotive electronics, security and medical systems, chipset development and
industrial automation.