INVL Technology - Notification on material event

BAIP UAB redeemed bonds from INVL Technology

Vilnius, Lithuania, 2017-05-05 07:11 CEST (GLOBE NEWSWIRE) -- INVL Technology
announced that BAIP UAB has redeemed bonds issued on 16 January 2017 in the
amount of EUR 1.55 million as of 4 May 2017. 


         AThe person authorized to provide additional information:
         Kazimieras Tonkūnas
         INVL Technology Managing Partner
         e-mail k.tonkunas@invltechnology.lt