Aspocomp Group - Other information disclosed according to the rules of the Exchange

ORGANIZATION OF THE BOARD OF ASPOCOMP GROUP PLC

Espoo, Finland, 2017-03-23 11:45 CET (GLOBE NEWSWIRE) -- 
Aspocomp Group Plc, Company Announcement, March 23, 2017 at 12:45 p.m.

In its organization meeting held today, the Board of Directors of Aspocomp
Group Plc re-elected Päivi Marttila as Chairman of the Board and Kaarina
Muurinen as Vice Chairman. 

The Board of Directors has at its meeting evaluated the independence of the
Board members in compliance with the recommendations of the Finnish Corporate
Governance Code. It is the view of the Board of Directors that all Board
members, other than Ms. Julianna Borsos, are independent of the company's
significant shareholders. The Board of Directors has also assessed that all the
Board members are independent of the company. 

Board committees were not established as the extent of the company's business
did not require it. 

For further information, please contact Mikko Montonen, CEO,
tel. +358 20 775 6860, mikko.montonen(at)aspocomp.com.

ASPOCOMP GROUP PLC

Mikko Montonen
CEO


Aspocomp – a service company specializing in PCB technologies

Aspocomp specializes in demanding PCB technologies, serving its customers
throughout the entire life cycle of a product. Aspocomp sells and manufactures
PCBs and also provides related design and logistics services as well as
technology solutions. Aspocomp creates value for its customers with unique
products and solutions, strong manufacturing and technology expertise, as well
as fast and reliable deliveries. A wide network of expert partners together
with Aspocomp's own manufacturing enables its customers to cost-effectively buy
their PCBs from a single provider over the entire life cycle of a product. 

A printed circuit board (PCB) is the principal interconnection method in
electronic devices. PCBs are used for electrical interconnection and as a
component assembly platform in most electronic applications. Aspocomp's
customers are companies that design and manufacture telecom systems and
equipment, automotive and industrial electronics, security technology and
semiconductor testing systems.